It is mainly used in the electronics industry, especially in the flat panel display industry, such as in the processing and production of TFE-LCD, COG, SMT, PDP, etc. Its mechanism of action is that when the driver IC is bonded to the glass by the ACF-Bonding hot press with heat and pressure, the Polytetrafluoroethylene film can play a role in high-temperature resistance, impact resistance, etc. It can prevent glass breakage caused by the segment difference and particles of the PCB, and also effectively prevent the overflow of conductive adhesive from contaminating the substrate and the surrounding environment, protecting the purity of the glass substrate.
三、List of application products
Mobile phone screens, computer screens, tablet computers, LCD TV screens and other mechanical equipment LCD screens, etc.
